Knowledge

The throughput of a high-speed die bonder depends on the bonding architecture and motion efficiency. In current production, some high-speed models can

An automatic die bonder works through a coordinated sequence of material handling, dispensing, pickup, and bonding. First, the loading mechanism trans

Bonding speed varies depending on the brand and specific model of the flip-chip die bonder. Currently, some high-performance pixel die bonders can ach

1.Startup Preparation 1.1 Turn on the air supply and power switch. Ensure air pressure is stable at 4–6 kg/cm² and voltage is 220 VAC. 1.2

A mini die bonder is specifically designed for die bonding on substrates used in Mini LED direct-view displays or backlight applications. Its primary

Annual maintenance for die bonders should be carried out in a structured sequence covering mechanical, electrical, optical, pneumatic, software, and p

Frequent die pickup failures on a die bonder are often closely related to incorrect ejector pin height. If the pin is set too low, the ejection force

A die bonder is mainly used to pick individual bare dies from dicing tape or blue film and place them precisely onto PCB substrates, glass substrates,

Frequent "MISSING DIE" alarms on ASM die bonders are a common issue in semiconductor packaging that can disrupt throughput and yield. The problem is o

The annual maintenance cycle for a die bonder is once per year, mainly involving deep maintenance of specific components such as the turbine. For dedi

A high-precision die bonder is a type of equipment that can fix dies within an extremely small error range. It is widely used in semiconductor packagi

The structural principle of a die bonder is mainly based on high-precision positioning and motion control technology. Its core components typically in