Bonding speed varies depending on the brand and specific model of the flip-chip die bonder. Currently, some high-performance pixel die bonders can achieve approximately 36,000 units per hour (36K/H) in earlier versions, while newer generations with improved motion control and indexing mechanisms can reach up to 50K/H, representing a throughput increase of around 60%. Achieving stable operation at these speeds requires precision mechanical components such as linear guides, cams, and pickup heads with tight tolerances and good repeatability. For non-standard high-speed motion parts used in flip-chip bonders, Hansheng Automation can provide custom machining based on equipment specifications to support consistent performance.
