Packaging Machinery

SMT pick-and-place machines are the core equipment in SMT production and are generally divided into two main categories: turret type and gantry type.

SMT pick-and-place machine brands are primarily divided into German, Japanese, and Korean manufacturers, each with distinct strengths. German brand: S

The core process of semiconductor power IC packaging and testing includes three main stages: wafer testing, packaging, and final testing. The detailed

Chip failure analysis methods mainly include destructive analysis, non-destructive analysis, physical analysis, and chemical analysis. Corresponding e

Integrated circuit test equipment can be divided into four major categories according to chip type, with each category targeting different test requir

Model: SPP-660 (with socket) Functions: Automatic loading: The equipment can efficiently, stably, and accurately load chips from trays into sockets on

The operation of a chip probing machine must strictly follow the equipment manual and chip testing specifications. The core process includes five key

The chip inspection process generally involves wafer-level testing and final testing, with four core types of test equipment commonly used. Probe Stat

Testing the FR9608 chip requires the following five core categories of instruments and equipment: Signal and Waveform Analysis Equipment Oscilloscope:

Chip CP (Circuit Probing) testing requires a range of equipment and tools, including measurement instruments, program development and simulation envir

Front-End Test Equipment Probe Station: Used for wafer-level testing. Key parameters include positioning accuracy of ±1 μm and a maximum tem