A die bonder is mainly used to pick individual bare dies from dicing tape or blue film and place them precisely onto PCB substrates, glass substrates, or lead frames. It is commonly found in LED packaging and semiconductor back-end assembly processes. A pick-and-place machine, by contrast, handles SMT components such as resistors, capacitors, and ICs, feeding them from tape reels or trays and mounting them at high speed onto solder-pasted PCBs.
The two types of equipment differ significantly in terms of pickup objects, feeding methods, placement accuracy, and speed requirements. For non-standard nozzles, customized guide rails, positioning fixtures, and other critical precision parts used on these machines, we can provide small-batch contract manufacturing based on equipment models and process parameters to support stable placement performance.
