Frequent die pickup failures on a die bonder are often closely related to incorrect ejector pin height. If the pin is set too low, the ejection force may be insufficient, causing poor separation of the die from the blue tape and resulting in unstable pickup. If the pin is set too high, it may strike the die too hard, leading to die cracking, machine jamming, or even safety risks for the operator. Therefore, the ejector pin height must be adjusted within a controlled range and verified through actual bonding results.
A practical adjustment procedure is to first set the pin to a moderate height, then run a few pickup and bonding cycles, and finally fine-tune the height based on the observed die ejection and placement quality until consistent performance is achieved. This iterative approach helps prevent both insufficient ejection and excessive impact.
During repeated adjustments, stable and repeatable height setting depends on the mechanical condition of the ejector assembly. Worn height adjustment blocks, loose limit screws, or deformed pin holders can make the setting drift over time. For such cases, custom-machined height calibration blocks, precision limit spacers, or ejector pin holders matched to the specific bonder model can be provided by Hansheng Automation to ensure repeatable positioning and reduce process variation.
