Packaging Machinery

KS wire bonders may encounter several common faults during operation. One typical issue is unsatisfactory bonding appearance, where the bonded wire sh

Threading wire in a semiconductor wire bonder requires careful attention to preparation, operational standards, and safety to ensure smooth wire feedi

A wire bonder is a specialized machine used to connect wires to electronic components or to interconnect internal leads within semiconductor devices.

The automatic measurement device for wire tail length and free air ball size on a wire bonder operates through visual imaging, displacement sensing, a

Crossed roller guides are widely used in linear motion systems that require high rigidity, high load capacity, and precise positioning. Typical applic

Wafer Film Expansion Procedure Disassemble the wafer ring and place the inner ring onto the wafer expanding machine. Before expansion, press the red b

The throughput of a high-speed die bonder depends on the bonding architecture and motion efficiency. In current production, some high-speed models can

An automatic die bonder works through a coordinated sequence of material handling, dispensing, pickup, and bonding. First, the loading mechanism trans

Bonding speed varies depending on the brand and specific model of the flip-chip die bonder. Currently, some high-performance pixel die bonders can ach

1.Startup Preparation 1.1 Turn on the air supply and power switch. Ensure air pressure is stable at 4–6 kg/cm² and voltage is 220 VAC. 1.2

A mini die bonder is specifically designed for die bonding on substrates used in Mini LED direct-view displays or backlight applications. Its primary

Annual maintenance for die bonders should be carried out in a structured sequence covering mechanical, electrical, optical, pneumatic, software, and p