Wafer Film Expansion Procedure
Disassemble the wafer ring and place the inner ring onto the wafer expanding machine.
Before expansion, press the red button on the expander to release residual air inside the machine, preventing excessive pressure from damaging the die film.
Place the die film above the area of the inner ring, ensuring the dies face upward and all four edges of the film extend beyond the inner ring. The distance between the outermost dies and the inner ring should be greater than 2 cm.
Cover with the clamping fixture and lock it. Gently press the green button to expand the film upward to the appropriate position. Then place the outer ring, press and hold the rightmost button to crimp the outer ring onto the inner ring, and trim the excess film extending beyond the ring with a blade.
Remove the wafer ring, open the fixture, and clean off any remaining excess film.
Consistent expansion quality depends on the flatness and precise fit of the wafer rings and clamping fixture. For worn or non-standard ring sizes, Hansheng Automation can provide custom-machined replacement parts matched to the specific die bonder.
Silver Epoxy Preparation
(Refrigerated silver epoxy should first be thawed to room temperature.)
Install the epoxy plate correctly onto the die bonder. Rotate the spiral scraper upward until it is 1–2 mm above the epoxy plate surface.
Confirm that the epoxy plate is rotating, then add silver epoxy. The amount should be controlled according to process needs. After adding, slowly rotate the spiral scraper downward until it is level with the epoxy surface in the plate.
