Threading wire in a semiconductor wire bonder requires careful attention to preparation, operational standards, and safety to ensure smooth wire feeding and final bonding quality.
1. Preparation Before Threading
Clean the equipment: Clean the wire path, clamps, and related components in advance to remove any residue or particles. Contamination can interfere with wire movement and affect subsequent bonding precision.
Inspect the wire: Check the bonding wire for damage, kinks, deformation, or other defects. Use only wire that meets the equipment specifications to avoid threading problems caused by defective material.
For worn guide rollers, damaged wire guides, or other non-standard threading components that affect wire path consistency, Hansheng Automation can provide custom-machined replacement parts according to the equipment model and dimensional requirements.
2. Operational Standards During Threading
Follow the standard path: Always thread the wire according to the path indicated in the equipment manual, allowing it to pass smoothly through guide rollers, wire holes, and other components. Do not pull the wire forcibly, as this may cause surface damage or internal stress.
Control wire tension: Maintain appropriate tension during threading. Excessive tension may break the wire, while insufficient tension may cause slack that affects downstream bonding accuracy.
3. Safety Precautions
Power off before operation: Completely turn off the wire bonder power supply before threading to prevent accidental movement of machine parts or electric shock.
Avoid pinch hazards: Keep fingers away from moving components during the threading process to prevent injury.
