1. Pre‑test Preparation
Equipment & fixture verification
Calibrate temperature uniformity of burn‑in chambers and boards with standard thermocouples; maintain deviation within ±2 °C per JEDEC JESD22‑A108.
Periodically measure contact resistance of socket pins to prevent local overheating or signal loss due to oxidation or poor soldering.
Verify output voltage, current accuracy and ripple of power modules against the device datasheet to avoid over‑stress damage.
Sample pre‑treatment
Perform initial electrical testing to select visually intact and parameter‑compliant devices, excluding known defects before burn‑in.
Match dedicated burn‑in sockets to package types; for BGA/QFN high‑density packages, use thermal adapter plates to ensure uniform heat transfer.
Assign unique traceability codes (batch number, serial number) to each device, linking to preset test conditions.
2. Test Execution
Closed‑loop environmental control
Set burn‑in temperature at 80 %–90 % of the rated junction temperature, never exceeding the absolute maximum; typical values: 85 °C for consumer, 125 °C for industrial, and higher for automotive with additional thermal cycling.
Duration depends on application: 96‑168 h for logic ICs, over 200 h for memories, and extended cycling for automotive.
Record temperature, humidity, and power output in real time (at least every 15 min); trigger immediate alarm and shutdown on any deviation.
Stress application
Apply voltage stress at 100 %–110 % of rated operating voltage, never exceeding the absolute maximum rating.
For dynamic burn‑in, inject periodic input/clock signals to mimic actual working conditions.
Balance load distribution across multi‑device boards to avoid single‑chip overloading.
In‑process sampling
Extract samples every 24 hours to measure quiescent and dynamic parameters, screening early failures.
If a failure is found, expand sampling within the same batch and trace root causes.
3. Post‑test & Review
Cool the chamber to room temperature before removing samples to prevent thermal shock and package cracking.
Perform full parametric re‑testing and compare with pre‑burn‑in data; calculate failure rate and parameter drift.
Compile all process data (temperature curves, power logs, alarm records) into a standardized report and retain for at least 3 years.
Clean chambers and boards, removing dust and solder residue to maintain accuracy for subsequent runs.
4. Safety Precautions
Equip burn‑in systems with leakage protection and over‑temperature cut‑off (automatic shutdown at 5 °C above setpoint).
Post warning signs in high‑temperature areas; operators must wear insulated gloves and goggles.
Ensure adequate ventilation inside closed chambers to prevent localized heat accumulation.
Insulate high‑voltage modules, and periodically check insulation resistance to eliminate electric shock hazards.
For special package types or non‑standard test conditions, we can provide custom‑designed burn‑in sockets, adapter plates, and fixture components tailored to your specific mechanical and electrical requirements – ensuring seamless integration with your existing test platforms.
