Front-End Test Equipment
Probe Station: Used for wafer-level testing. Key parameters include positioning accuracy of ±1 μm and a maximum temperature of 150°C.
Automatic Test Equipment (ATE): Keysight P9000 series, supporting maximum current testing up to 100 A.
Parameter Analyzer: Measures parameters such as leakage current with a resolution down to 0.1 pA.
Post-Packaging Test Equipment
Handler: Sorts good and defective units. The UTS3000 series achieves a handling speed of 30K units per hour.
Burn-in Test System: Simulates high-temperature and high-humidity environments, and must comply with JEDEC JESD22-A104 standards.
X-ray Inspection System: Detects internal soldering defects with a resolution of 1 μm or better.
Key Parameter Measurement Equipment
Oscilloscope: Bandwidth of at least 1 GHz, such as the Tektronix 5 Series.
Power Analyzer: Measures conversion efficiency with an accuracy of ±0.05%.
Thermal Imaging Camera: FLIR A700 series, with a temperature resolution of 0.03°C.
Auxiliary Systems
Temperature and Humidity Chamber: Temperature range from -40°C to 150°C.
ESD Protection System: Workbench surface resistance between 10^6 and 10^9 Ω.
Automated Handling Robot: Repeatable positioning accuracy of ±0.02 mm.
For these auxiliary systems and test interfaces, Hansheng Automation can custom-machine precision fixtures, alignment brackets, and adapter plates according to customer specifications, ensuring stable integration and accurate positioning in power IC packaging test lines.
