The chip inspection process generally involves wafer-level testing and final testing, with four core types of test equipment commonly used.
Probe Station
The probe station is mainly used for wafer-level electrical testing after wafer fabrication and before packaging. It precisely places the test probes in contact with the chip pads to complete signal transmission and testing, serving as the first round of performance screening before packaging. For chips with non-standard pad layouts or special wafer sizes, Hansheng Automation can custom-machine probe card holders, alignment fixtures, and wafer chucks according to the specific test interface requirements, ensuring stable contact and accurate positioning during probing.
Tester
The tester, also known as automatic test equipment, is the core device in chip testing. It provides standardized excitation signals to the chip, receives the response data, and checks whether the logic functions and electrical parameters meet the design specifications. It can be used throughout both wafer testing and final testing.
Handler
The handler is used in the chip sorting stage after testing. Based on the test results, it separates qualified chips, defective chips, and chips of different performance grades into corresponding containers.
Burn-in Test Equipment
Burn-in test equipment simulates long-term operating conditions by subjecting chips to high temperature, high voltage, and extended operation. It is used to screen out chips with latent failures, mainly in the reliability verification stage for finished chips.
