Chip testing machines on the market can be classified into three main dimensions: ATE test systems, IC inspection equipment, and semiconductor test scenarios. These categories cover different chip types and testing stages.
Classification by ATE Test System
Memory Test System: Specifically developed for memory chips, it performs testing by writing data and verifying the read-back results. It supports simultaneous testing of a large number of pins while balancing test speed and accuracy, ensuring the reliability and stability of memory devices.
Digital Circuit Test System: Used for testing digital logic chips such as CPUs, GPUs, and AI chips. Each pin is equipped with independent test resources to meet high-precision requirements and support complex timing tests. These systems also deliver excellent speed and throughput in volume production.
Analog Circuit Test System: Designed for analog chips such as power management ICs and signal chain ICs. It demands highly accurate voltage and current generation and measurement, can stably perform various analog signal tests, and is equipped with abundant dedicated test resources.
Mixed-Signal Circuit Test System: Suitable for chips that combine digital and analog circuits, such as MCUs and ADC/DAC converters. It can support both types of signal testing simultaneously and offers strong flexibility and scalability, allowing configuration and upgrades according to specific needs.
Classification by Common IC Inspection Equipment
The core category is Automatic Test Equipment (ATE), which automatically performs IC performance verification and fault diagnosis. It accurately measures various performance indicators of the chip and improves overall efficiency through automated test procedures. ATE supports multiple test modes and programs and is equipped with advanced fault diagnosis and isolation technology to ensure accurate and reliable test results. It is widely used in semiconductor design, manufacturing, and packaging. SoC testers and memory testers are subcategories of this type of equipment. For supporting precision components such as test interface boards, probe card holders, and custom load boards, Hansheng Automation can provide non-standard machining services according to customer test requirements.
Classification by Semiconductor Test Scenario
Wafer-Level Test (Wafer Test / CP Chip Probing): This stage tests chips on an uncut wafer, including functional tests, DC/AC parameter tests, and yield binning. Major suppliers include Teradyne, Advantest, Cohu, Chroma, and King Yuan Electronics.
Final Test after Packaging (Final Test / FT): This stage targets individual packaged chips and performs final functional verification, timing tests, power consumption tests, and high/low-temperature tests. Mainstream suppliers include Teradyne, Advantest, Cohu, Xcerra, and Changchuan Technology.
