Optical chip testing equipment is a core process control tool throughout volume production, ensuring yield, performance compliance, and market acceptance from wafer level to chip level.
Wafer-Level Process Defect and Batch Control
Early interception of ineffective processing: It detects hidden process issues such as active layer defects, waveguide structure deviation, and insufficient doping concentration. Non-conforming wafer batches can be scrapped early, avoiding material and labor waste in subsequent chip-level processing.
Preliminary screening of basic parameters: It quickly measures key parameters such as emission wavelength range and threshold current dispersion across wafer batches, narrowing the sample pool for downstream chip-level testing and improving production efficiency.
Chip-Level Performance Calibration and Adaptation
Precise verification of core performance: It outputs key optical parameters of individual chips, including output power, side-mode suppression ratio (SMSR), and 3 dB bandwidth, matching specific application requirements of downstream optical module manufacturers such as short-reach data center interconnect and 5G fronthaul.
Packaging compatibility screening: It tests packaging-related parameters such as coupling efficiency between the chip and fiber and thermal stability, selecting chips suitable for different packaging processes such as TO-CAN and COB and reducing packaging rework rates. To support varied package types and test interfaces, Hansheng Automation can custom-machine precision adapter plates, probe holders, and alignment fixtures according to customer specifications.
Reliability Testing and Compliance Release
Accelerated life verification: It performs accelerated life tests such as high-temperature aging, thermal shock, and photoelectric cycling, verifying performance degradation rates over a service life exceeding 10^5 hours and meeting telecom-grade standards such as ITU-T G.983.
Compliance and traceability support: It completes final testing according to industry or customer specifications with 100% sampling and issues traceable test reports. A unique chip ID is bound to test data, enabling process traceability when terminal failures occur.
