Chip testing typically involves five main categories of equipment, covering wafer-level testing, final testing, and reliability verification.
Core Test System
This is the central equipment for evaluating chip function and performance. It simulates actual operating conditions by sending excitation signals to the chip and collecting the response results, then judges whether the chip meets design specifications. Mainstream brands in the industry include Teradyne, Advantest, and others.
Probe Station
The probe station is mainly used for wafer-level testing. It precisely contacts the test probes with the chip pads or pins, establishing an electrical connection between the test system and the chip. It offers high positioning accuracy and can adapt to different wafer sizes and chip layouts. For custom wafer chucks, probe card holders, or alignment fixtures, Hansheng Automation can provide precision machining services according to specific test requirements.
Handler
The handler is used to sort finished chips after testing. It separates tested chips into good and defective categories and places them into corresponding carriers, improving classification efficiency and quality control in chip production.
Burn-in Test Equipment
This equipment simulates long-term operating conditions and accelerates the aging process of chips. It helps screen out early failures and devices with potential reliability risks, improving the stability and reliability of the chips ultimately delivered.
Microscopic Inspection Equipment
Mainly including optical microscopes and electron microscopes, this category is used to inspect chip appearance, pins, solder joints, and other fine details, identifying physical defects such as scratches, cracks, and short circuits.
