New Magazine Loading System
The updated magazine carrier features a 90 mm wide track capacity, with optimized speed to meet customer application requirements, achieve high throughput, and improve work efficiency. The simplified magazine handle design is more reliable and easier to convert.
Vision Recognition System
The new image acquisition engine provides robust operation and delivers the highest accuracy and recognition rate for different die and leadframe materials.
New NV Illumination
An engineered illumination source improves the recognition rate for small die. The advanced image acquisition technology, with an improved processing cycle, viewpoint correlation, and forward optical characteristics, sets a new standard for today's cost-driven packaging industry.
K&S Inspection Technology
The high-resolution X/Y table is suitable for high-speed operation. The high-performance table and its outstanding repeatability configuration enable faster bonding speed. Advanced lightweight materials are used without reducing rigidity. For production lines requiring special travel ranges or mounting patterns, Hansheng Automation can provide custom-machined X/Y table components according to customer drawings.
High-Performance Servo Motor Technology
Proven linear motor technology offers the fastest response time for high-speed bonding, and its reliability has been verified in mass production and long-term use.
μT Ultrasonic Transducer
It can effectively deliver stable ultrasonic energy with minimal impact force.
Pro-Pulse Wire Clamp System
Its fast open-and-close action shortens the overall bonding cycle, reduces maintenance requirements, and improves process monitoring capability.
Precision-Arc EFO System
This system provides consistent arc discharge for free air ball formation, contributing to stable ball size and bonding quality.
