A fully automatic wire bonding machine is a highly integrated optical, mechanical, and electronic system combining computer control, motion control, image processing, and network communication. It consists of multiple high-precision XYZ platforms and demands fast response, low vibration, high efficiency, stable ultrasonic output, a reliable EFO system, and accurate image capture. The welding material is fed and collected through a fully automatic loading and unloading system, enabling continuous automatic bonding cycles.
The equipment is widely used for inner lead bonding in the production of LED lamps, SMD components, high-power LEDs, transistors, digital displays, dot matrix boards, backlight units, COB IC modules, CCD modules, and various specialty semiconductor devices.
Because the XYZ platforms and automatic loading system require high rigidity and precise motion coordination, Hansheng Automation can custom-machine related structural components such as platform mounting seats, precision guide brackets, and workpiece fixtures according to customer drawings, with dimensional tolerances controlled within ±0.005 mm to support stable high-speed operation.
