The carrier particle machine is a professional production equipment that melts and plasticizes plastic particles and other raw materials, forms them into carrier substrates through precision molds, and precisely punches component storage grooves on the substrates. Its core principle is the linkage control of plasticization molding and positioning punching.
1, Core workflow
Plasticization feeding: After the granular raw materials are fed into the hopper, they are sheared and heated by the screw in the heating cylinder (temperature 160-280 ℃, adjusted according to the type of raw material such as PET/PP/PC) to form a uniform melt, which is quantitatively pushed to the molding mold cavity by the conveying screw.
Forming and shaping: The melt enters the integrated precision forming mold for cooling and shaping, obtaining a continuous carrier substrate roll with a thickness accuracy of ± 0.02mm and a width matching the subsequent winding or slitting requirements.
Positioning punching: The formed substrate is accurately aligned by identifying the reference edge/positioning hole through a photoelectric sensor, and the servo/hydraulic drive system of the linked punching die punches out the SMT component receiving groove at the designated position with a punching accuracy of ± 0.01mm, avoiding component adaptation deviation.
Roll up and slitting: The finished product carrier tape after punching is rolled up into a disc by a tension control device, with a tension value of 5-15N, to prevent the carrier tape from stretching and deforming; Synchronize the cutting operation when multiple specifications are required.
