The wafer appearance defect machine vision inspection system is an efficient and precise automated inspection device mainly used to detect various defects on wafer surfaces, such as breakage, cracked particles, pores, and poor nickel plating. The system uses industrial cameras, lenses, light sources, and advanced image processing algorithms to achieve comprehensive inspection of wafer appearance.
1. Inspection Contents and Requirements
Workpiece size: Suitable for wafer samples with dimensions of 1.44 mm in length, 1.43 mm in width, and 1.65 mm in height.
Inspection items: Mainly include breakage, cracked particles, pores, poor nickel plating, and related defects.
Inspection methods: Multiple methods are used, including bottom front lighting, side front lighting, and top front lighting, to ensure full coverage of the wafer surface.
Inspection efficiency: 250 to 350 wafers can be inspected per minute, depending on the feeding speed.
Stage-based inspection: Inspection steps are divided according to the inspection content to ensure that each step accurately identifies and handles defects.
2. Equipment Composition and Main Mechanisms
Overall structure: The equipment dimensions are 900 mm × 800 mm × 1850 mm, with the model INTSOFT_T300.
Core components:
Vision inspection software: Provides image processing algorithms and inspection logic for automatic wafer defect recognition.
Industrial computer: Runs the inspection software and processes image data.
Display: A 19-inch monitor displays inspection results and the operation interface.
Industrial cameras and lenses: Six sets in total, including one bottom front light camera, four side front light cameras, and one top front light camera, paired with FA industrial lenses for clear imaging.
Professional glass disc: Holds wafers and keeps their positions stable during inspection.
Solenoid valves, reducer, and vibrating cabinet: Used for wafer feeding, positioning, and transfer.
Feeding equipment: Includes vibrating plates, linear vibrators, and controllers for automatic wafer loading. For the glass disc mounting plates, camera brackets, and precision structural parts used in this type of system, Hansheng Automation provides custom machining according to customer drawings.
3. Inspection Methods and Effects
Bottom front lighting inspection: Captures images of the wafer bottom. The system identifies qualified wafers and can accurately detect defects such as cracked particles and poor nickel plating, marking the defect positions and types.
Side front lighting inspection: Captures side images of the wafer. It identifies qualified wafers and accurately detects defects such as breakage and pores, marking the defect positions and types.
4. System Installation Requirements
Inspection space: The system should be installed separately beside the production line with adequate space.
Ambient temperature: 0°C to 50°C to ensure normal operation.
Humidity: Below 90% RH to prevent moisture from affecting performance.
Electronic interference: Install in an area with minimal electronic interference to ensure inspection accuracy.
Power and air supply: AC 220 V, 50 Hz, power consumption below 1 KVA, and air pressure of 0.35 to 0.7 MPa.
In summary, the wafer appearance defect machine vision inspection system is an efficient and precise automated inspection device capable of comprehensive surface defect detection. It offers high inspection efficiency, high accuracy, and simple operation, making it an essential part of wafer production lines.
