Electronic component production relies on specialized equipment across design, wafer fabrication, packaging, and testing. Different component categories require different tool sets. The following is an overview of core equipment by category.
1. Core Equipment for Semiconductor Components
Wafer fabrication: lithography machines (including EUV and DUV systems), ion implanters, chemical vapor deposition (CVD) equipment, physical vapor deposition (PVD) equipment, etchers, cleaning systems, wafer inspection tools, and annealing furnaces.
Packaging and testing: wire bonders, encapsulation dispensing machines, dicing saws, chip test handlers, and burn-in test equipment.
Many critical parts in these systems-such as wafer stage components, vacuum chamber fittings, electrodes, and test sockets-are non-standard and require precision custom machining. Hansheng Automation supports equipment manufacturers and fabs with small-batch production of these components based on customer drawings.
2. Equipment for Passive Electronic Components
Capacitors: vacuum sintering furnaces, winding machines, formation equipment, and withstand voltage testers.
Resistors: screen printers, sintering furnaces, and laser trimming machines.
Inductors: winding machines and vacuum encapsulation equipment.
These systems often require custom fixtures, jigs, and electrode assemblies. We can machine such non-standard parts to meet specific process requirements.
3. Equipment for Printed Circuit Boards (PCBs)
Drilling machines, exposure machines, developing machines, etching machines, electroplating lines, automated optical inspection (AOI) equipment, and laminators are commonly used. Precision guide rails, drilling spindles, and registration pins are often machined to tight tolerances. Hansheng Automation provides custom machining of these parts for PCB equipment manufacturers.
4. Other Supporting Equipment
Material preparation: vacuum melting furnaces, single crystal furnaces, and powder sintering furnaces.
Quality inspection: high-low temperature test chambers, salt spray testers, and life test benches.
Soldering: reflow ovens and wave soldering machines.
We also machine test fixtures, mounting plates, and structural components for these supporting systems.
Note: Some high-end equipment such as EUV lithography still faces technical barriers in domestic mass production. As of 2024, domestic DUV lithography for 90nm has achieved small-batch shipment.
Overall, stable performance of electronic component production equipment depends on precision-machined non-standard parts. Hansheng Automation focuses on custom machining for semiconductor, passive component, and PCB equipment, supporting R&D validation and pilot production needs.
