Chip yield scanning equipment mainly falls into three categories: optical inspection, e-beam inspection, and metrology tools. These systems are used for defect detection and critical dimension measurement throughout the wafer manufacturing process.
1. Optical Inspection Equipment
This type of equipment uses optical imaging for fast, non-contact defect scanning:
Bright-field/dark-field inspection systems: capture surface defects using different illumination methods, with inspection speeds reaching tens of thousands of wafers per hour.
Macro inspection systems: quickly detect macroscopic defects such as scratches and contamination on wafer surfaces.
Photomask inspection systems: specifically detect pattern defects on lithography masks, using deep ultraviolet light sources (193nm wavelength) to achieve sub-micron resolution.
2. E-Beam Inspection Equipment
Focused electron beams enable ultra-high-resolution inspection:
Scanning electron microscopes: achieve nanometer-level resolution for precise identification of small defects and pattern anomalies.
Voltage contrast inspection: detects electrical defects such as open or short circuits, making it an essential inspection method for advanced nodes.
3D structural inspection: uses electron beam tomography to reconstruct chip three-dimensional structures, checking via and interconnect quality.
3. Metrology Equipment
These tools focus on precise measurement of dimensions and film properties:
Scatterometry OCD measurement systems: use optical critical dimension measurement technology to simultaneously measure linewidth, sidewall angle, and film thickness.
Atomic force microscopes: provide atomic-level surface morphology measurement for critical dimension and surface roughness inspection.
X-ray diffractometers: analyze crystal structure and stress distribution, monitoring silicon wafer quality and process stability.
Major Equipment Suppliers
KLA: holds over 50% global market share, offering a full range of inspection solutions.
Applied Materials: has strengths in e-beam inspection.
ASML: its HMI subsidiary specializes in e-beam inspection technology.
Hitachi High-Tech: provides advanced defect review and analysis systems.
The latest generation of inspection equipment has adopted artificial intelligence algorithms for defect classification and root cause analysis, achieving detection accuracy below 2 nanometers to meet yield control requirements for 3nm and more advanced process nodes.
For the precision motion stages, wafer chucks, optical sensor mounts, and alignment fixtures integrated into these yield scanning systems, Hansheng Automation provides custom machining based on customer drawings, supporting single-piece or small-batch delivery.
