According to reports from Taiwan's Economic Daily and Industrial and Commercial Times, TSMC held the inauguration ceremony of its AP8 advanced packaging plant on the 2nd of this month. Compared to the previous 2nm expansion ceremony, this event is more low-key, with participation mainly from TSMC and supply chain partners.
TSMC AP8 Factory was transformed from Innolux Optoelectronics South Technology Plant 4 and was originally a 5.5-generation LCD panel factory. On August 15, 2024, TSMC purchased this factory and ancillary facilities located in Tainan City for NT $17.14 billion (note: the current exchange rate is approximately NT $3.772 billion), and the renovation from the Fourth South Technology Plant to AP8 began accordingly.
It is reported that the renovation and refurbishment of AP8 factory will be divided into two stages. The first phase of the project will be completed as scheduled by the end of March and enter the equipment installation stage. AP8 factory is currently TSMC's largest advanced packaging facility, with an area approximately four times that of the previous AP5 factory, and a clean room area of nearly 100000 square meters.
TSMC's AP8 advanced packaging plant is expected to be put into operation as early as the end of this year, and is expected to be used for CoWoS production to meet the huge demand of customers for this process of integrating logic chips and HBM memory 2.5D.