On May 20, Lei Jun, the founder of Xiaomi, announced a major news: the Xuanjie O1 chip has successfully entered the large-scale mass production stage, and two flagship products equipped with the chip - the high-end flagship mobile phone Xiaomi 15SPro and the ultra-high-end OLED tablet Xiaomi Tablet 7Ultra will also be unveiled simultaneously. Just two days later, on May 22, the Xuanjie O1 chip was officially unveiled and made a stunning appearance on the Xiaomi 15SPro mobile phone and Xiaomi Tablet 7Ultra.
XRINGO1 (XRINGO1), as the second-generation 3nm mobile phone SoC chip independently developed and designed by Xiaomi, adopts a ten-core four-cluster CPU design and achieves a laboratory score of 3 million. It integrates 2 X925 super cores (maximum main frequency 3.9GHz), 4 A725 performance cores (maximum main frequency 3.4GHz), 2 A725 low-frequency energy-efficient cores (maximum main frequency 1.9GHz) and 2 A520 super energy-efficient cores (maximum main frequency 1.8GHz). In the initial baseband solution, Xuanjie uses the external MediaTek 5G baseband to reduce technical risks with the "SoC+baseband separation" solution; the number of transistors is as high as 19 billion. CCTV News highly praised the Xuanjie O1 chip released by Xiaomi, calling it "a breakthrough in 3nm chip design in mainland China, closely following the international advanced level." Geek Bay also said that Xuanjie O1 is indeed self-developed by Xiaomi, and its "Layout design and the back-end of each core IP have their own design ideas. The Xuanjie team even designed more customized Cells in addition to the Cells of TSMC's N3E process standard." At the same time, Lenovo is also making efforts in the chip field and bringing new self-developed chips. In early May, Lenovo released the YOGA Pad Pro 14.5 AI Yuanqi Edition, which is equipped with its self-developed 5nm chip, which has powerful performance and is designed for AI large tablets. It is understood that Lenovo's self-developed chip model is "SS1101", which adopts a 2+3+2+3 ten-core CPU architecture, has 2 X3 super-large cores with a main frequency of 3.29GHz, and a G720-Immortalis GPU (core number ≥ 10). The chip GeekBench 6 running score exceeds 2000 for single-core and 6700 for multi-core, which is basically the level of Dimensity 8400. In fact, as early as January 26, 2022, Lenovo Group established Dingdao Zhixin (Shanghai) Semiconductor Co., Ltd., integrating the internal chip design team and focusing on chip research and development, and has now achieved remarkable results.
Huawei has also made remarkable achievements in the field of chips. It has previously launched a series of highly anticipated Kirin processors, from Kirin 9000S to Kirin 9020, constantly refreshing the performance height of domestic chips. With the continuous evolution of technology, the Kirin X90 processor has also been confirmed to be first equipped by Huawei Hongmeng Computer Extraordinary Master. This folding PC not only has a large-area linear motor built in, which can simulate keyboard typing and bring a unique user experience, but also carries a new Hongmeng computer operating system to achieve collaborative innovation of software and hardware.
In addition to the above three technology giants, vivo is also actively deploying in the field of chips. In May 2025, vivo launched the forward-looking "Blue Pole Star Plan". The plan is aimed at the world's top doctoral students, with a generous salary of "uncapped salary", focusing on chip design, AI large models, and XR three frontier fields. vivo knows that the essence of chip competition is the competition of talents, so through two major innovation dimensions, it strives to create a talent highland and technology innovation platform for chip research and development. First, deepen the integration of industry, academia and research, establish joint laboratories with top universities such as Tsinghua University and ETH Zurich, so that doctoral students can directly participate in the actual R&D process of vivo chip tape-out, and achieve a close combination of theory and practice; second, promote scenario-based technology incubation, deeply bind the imaging chip team with the mobile phone product line, ensure that the R&D results can be quickly put into commercial use within 6 months, and accelerate technology transformation and product iteration.
At present, vivo has initially established a full-link technical barrier from sensors, ISP to AI photo editing through the collaboration of self-developed V series imaging chips and algorithms, and its own SoC chips should be released in the future. It is not difficult to see that the wave of mobile phone chip autonomy in 2025 is rising.