On May 30th, it was reported that Huawei Executive Director Zhang Ping'an recently stated that our semiconductor can solve 7nm very, very well.
Zhang Ping'an said, "In China, we definitely won't get 3nm, we definitely won't get 5nm. If we can solve 7nm, it's very, very good."
"The direction of innovation in China must rely on the direction of our chip capabilities. Our innovation direction cannot be in single point chip technology, but should be in system architecture," said the Huawei executive director.
In fact, for domestic semiconductor manufacturers, it will still be difficult to produce chips of 7nm and below for a long time in the future.
According to reports from the Semiconductor Industry Association (SIA) and Boston Consulting Group (BCG), China will produce 28% of chips below 10nm by 2032, but advanced processes are expected to only produce 2%.
Like China, the United States currently does not have the ability to produce chips below 10nm, but this is not a big problem for them. TSMC, Samsung, and others have already started building factories in their home country.
It is expected that the chip production capacity in the United States will increase by 203% in the next decade. By 2032, the chip production capacity of the United States will account for 14% of the total global production capacity.
For chips ranging from 10 to 22nm, China's production capacity share will double by 2032, from 6% to 19%
For chips above 28nm, it is expected that China's share will increase the most, from 33% in 2022 to 37% in 2032.