The biggest difference between high-precision die bonders and ordinary die bonders lies in bonding accuracy. High-precision die bonders can place more dies on a unit substrate, with smaller die gaps. Improved accuracy leads to higher yield and can meet the die bonding requirements of Mini LED and even Micro LED. At present, some high-precision die bonding equipment can achieve position accuracy within ±10μm and angular error below 0.2°. Such equipment places extremely high demands on the dimensional accuracy and stability of motion platforms, bonding heads, and vision alignment modules. Hansheng Automation provides single-piece or small-batch precision machining of key non-standard components for high-precision die bonders based on customer drawings.
