A reflow soldering oven, also called a reflow soldering machine or reflow oven, is equipment that provides a controlled heating environment to melt solder paste so that surface mount components and PCB pads are reliably joined through the solder alloy.
The reflow oven works by directing heated gas inside the chamber onto the solder paste printed on the PCB pads. The solder paste melts into liquid solder, allowing SMT components to bond with the board. After the board passes through the cooling section of the reflow oven, the solder solidifies and forms the final solder joints. Under controlled high-temperature airflow, the paste-like solder undergoes the physical change required to achieve the soldering result in the SMT process.
