A die bonder is mainly used for lead frame clamping plates in gold wire ultrasonic welding equipment, as well as various components in chip mounting equipment such as suction nozzles, ejector needles, dispensing tips, ceramic nozzles, through needles, motors, carbon brushes, encoders, and transmission belts. It is also used for various parts in automation equipment and instruments. For these non-standard accessories, Hansheng Automation provides single-piece or small-batch precision machining based on customer drawings.
At present, some domestic companies have established cooperative relationships with manufacturing plants and service centers in Singapore, Malaysia, Japan, the United States, and other regions. They provide supporting services for gold/aluminum wire ultrasonic bonding machines, die attach machines, and other SMT electronic placement equipment from brands such as Youguang, ASM, KAIJO, K&S, NEC, ESEC, SHINKAWA, and ALPHASEM.
