Semiconductor push/place machines mainly include specialized push/place equipment for three stages: wafer manufacturing, chip packaging, and device testing. For non-standard components and fixtures used in these machines, Hansheng Automation provides single-piece or small-batch precision machining based on customer drawings, covering materials such as aluminum alloys, stainless steel, and engineering plastics, with critical dimensional accuracy controllable to ±0.01mm.
I. Specialized Push/Place Equipment in Wafer Manufacturing
Wafer basket push/place equipment: Used for batch transfer and temporary storage of 200/300mm wafers, typically consisting of a push/place robot compatible with FOUPs (Front Opening Unified Pods). It supports pushing in vacuum or atmospheric environments and meets the Class 1 cleanroom requirements of 12-inch wafer fabs.
Single-wafer push/place robot: Used for precise wafer transfer between processes such as lithography and etching. The end effector is equipped with a vacuum suction head, with repeatability of ≤±0.1mm. It is a core supporting unit for single-wafer semiconductor equipment.
II. Specialized Push/Place Equipment in Chip Packaging
Lead frame push/place mechanism: Compatible with QFP, SOP, and other package types, enabling batch loading/unloading and pushing of frame trays. It features photoelectric positioning correction to prevent frame misalignment during operation.
Bare die placement push/place unit: Used for single-die pick-and-place and pushing, with vision centering function, positioning accuracy of ≤±0.05mm, suitable for IC packaging with pin pitches down to 0.3mm.
III. Specialized Push/Place Equipment in Device Testing
Test socket push/place fixture: Used to quickly push devices into test sockets during testing. It features fool-proof design to prevent reverse polarity insertion and is compatible with testing of plastic-encapsulated ICs and wafer-level devices.
Test sorting auxiliary push/place unit: Triggered by test data to perform classified push/place, realizing sorting of qualified/unqualified devices, suitable for post-test transfer of passive components and miniature ICs.
