Wafer Testing Equipment Overview

Aug 27, 2026 Leave a message

Karen Wong
Karen Wong
As a project manager, Karen oversees the entire lifecycle of projects from planning to execution. Her role ensures timely delivery of high-quality products to meet customer expectations.

Wafer testing equipment mainly includes three categories: probe stations, testers, and sorters, corresponding to electrical contact, performance testing, and classification screening respectively.

 

1. Probe Station

Function: It is the key equipment for wafer electrical testing. Its core task is to precisely position and bring probes into contact with micron-level pads or pins on the chip, establishing a signal transmission path.

Technical core: Its accuracy directly determines test reliability. Main technical indicators include positioning accuracy (high-end equipment can currently reach within ±1 μm), contact repeatability, and supported temperature range (e.g., -55°C to +150°C). Probe stations require high-precision motion stages, probe card holders, and thermal chucks to maintain stable contact during testing.

 

2. Tester

Function: The tester serves as the "brain" of the test system. It applies pre-programmed excitation signals to the chip and collects output responses to determine chip functionality, performance, and yield.

Classification: Based on the type of chip under test, testers are mainly divided into:

SoC testers: used to test logic function and performance of complex chips such as system-on-chip (SoC), processors, and baseband devices.

Memory testers: specifically used to test read/write speed, storage capacity, and reliability of DRAM, Flash, and other memory chips.

Analog testers: used to test analog or mixed-signal chips such as power management ICs (PMIC) and RF chips.

 

3. Sorter

Function: After wafer test (CP) or final test (FT), the sorter automatically classifies chips based on test results, such as separating good units, defective units, and different performance grades.

 

Application: It can be used for post-test screening at wafer level, or for final testing and sorting of individual packaged chips.

 

In actual production lines, these three types of equipment usually work together to form a complete test flow, serving as the core guarantee for chip quality and performance before shipment. For the precision components in these systems-such as probe card alignment fixtures, test sockets, sorter guide rails, and vacuum pickup tools-Hansheng Automation provides custom machining based on customer drawings, supporting single-piece or small-batch delivery.

Electronics--3C-Manufacturing