Semiconductor chip packaging involves a range of materials and specialized equipment, each serving a distinct function in the assembly and testing flow.
Packaging Materials
- Package substrate: provides electrical connection, protection, support, heat dissipation, and assembly functions.
- Leadframe: includes the frame body, die pad, support legs, and leads; used to achieve electrical interconnection.
- Molding compound: offers structural and mechanical support, protects electronic components from environmental damage, and maintains circuit insulation.
- Bonding wire: mainly gold wire and copper wire for electrical connections between the die and leads.
- Adhesive materials: includes blue tape, UV tape, silver paste, DAF film, and other indirect materials used during assembly.
Packaging Equipment
- Backgrinding machine: used for wafer backside thinning to improve heat dissipation and facilitate subsequent packaging steps.
- Dicing saw: includes blade dicing saws and laser dicing saws for cutting wafers or materials into individual dies.
- Tester: specialized equipment for checking chip function and performance, used in CP and FT test stages.
- Sorter: applied in FT testing after packaging to provide chip sorting and classification.
- Prober: used in CP testing after wafer processing and before chip packaging, responsible for wafer transport and positioning.
For precision components in the above packaging equipment-such as dicing chucks, tester sockets, prober stages, or leadframe clamping fixtures-Hansheng Automation provides custom machining services based on customer drawings, supporting single-piece or small-batch delivery.
