IC chip production involves a wide range of equipment, including lithography machines, chemical vapor deposition (CVD) systems, etchers, ion implanters, surface treatment equipment, dicing and thinning tools, metrology and defect inspection systems, bonding and packaging machines, testers, handlers, probers, diffusion furnaces, oxidation systems, and cleaning equipment. Among these, X-ray inspection plays a key role in chip inspection as a mainstream non-destructive testing method.
Equipment Used in IC Chip Production
In wafer fabrication, lithography, CVD, etching, ion implantation, and surface treatment equipment are used to precisely build transistors, resistors, capacitors, diodes, and interconnects on a semiconductor wafer. The lithography machine projects circuit patterns onto the wafer and is one of the core tools, with its accuracy directly affecting chip performance and integration.
In packaging, dicing and thinning equipment cuts the wafer into individual chips and reduces thickness. Metrology and defect inspection systems check external and internal defects before packaging. Bonding and packaging machines connect the chip to leads and seal it in a package to provide the required circuit functions.
In testing, testers evaluate electrical performance against design requirements. Handlers sort chips according to test results. Probers make electrical contact with chip pins during testing.
Other front-end processes include diffusion, oxidation, and cleaning equipment. Diffusion tools introduce dopants to modify electrical properties, oxidation systems form insulating and protective oxide layers, and cleaning equipment removes surface impurities and contaminants.
Importance of X-ray Inspection
X-ray inspection offers a non-destructive advantage. Traditional methods often require layer-by-layer removal of the chip and imaging each layer with an electron microscope, which can damage the sample. X-ray inspection uses the ability of X-rays to penetrate materials and attenuate within them to detect defects without causing damage. This is especially important for high-value or irreparable chips because it avoids inspection-induced damage and reduces production costs.
X-ray inspection can accurately identify internal defects. X-rays generated by the X-ray source penetrate the chip and form an image. When X-rays pass through a material, absorption and scattering reduce ray intensity. Differences in attenuation caused by the workpiece and its internal defects create intensity variations, producing defect images on film or digital detectors. Defects such as cracks, voids, and inclusions can therefore be located and evaluated.
X-ray inspection also helps ensure product quality and safety. By examining the nature, size, and location of defects, manufacturers can assess material or product quality and prevent major failures caused by internal defects or poor processing.
In addition to chips, X-ray inspection is also used for lithium batteries, LED beads, semiconductors, and other products, which broadens equipment utilization.
For X-ray inspection systems, probers, handlers, and related inspection equipment, Hansheng Automation provides custom machining of non-standard parts such as fixture plates, shielding enclosures, positioning components, and sample stages according to customer requirements.
