The process of chip sorting and tray placement is precisely achieved through automated equipment, with core steps including loading, visual inspection, sorting judgment, picking, tray placement, and information recording.
1. Loading
Place the chips to be sorted in a specific loading device, such as a material box or wafer box. Efficient equipment usually adopts a fully automatic feeding system, which automatically transports the wafer box to the designated position through a robotic arm or conveyor belt.
2. Visual inspection and positioning
-Using high-resolution cameras and image processing technology to take photos of chips and accurately obtain their image information.
-Analyze images to identify chip features, including size, shape, color, and defect conditions, while accurately determining the position and angle of the chip, providing coordinates for subsequent picking.
3. Sorting and judgment
-Analyze and evaluate the detected chip features based on preset parameter standards.
-Classify chips based on analysis results, such as performance, grade, or whether there are defects.
4. Pick up
Use customized vacuum nozzles or grippers as pick and place heads to accurately pick up chips based on visual positioning information. The picking and placing head is installed on a high-precision motion platform and can move flexibly in the X, Y, and Z axis directions to ensure stable grasping.
5. Transfer and Placement
-Transfer the picked chips to the corresponding placement areas according to the sorting results, and place chips of different categories in different trays.
-The material tray has a specific layout and slot position, and the equipment precisely controls the placement of chips one by one according to the predetermined arrangement, ensuring neat arrangement.
6. Information recording
Throughout the process, the system will record relevant information about each chip, such as sorting results, location, and testing parameters, which will be stored in a database for easy traceability and management.
7. Material cutting
After the tray is placed, remove the tray containing sorted chips from the equipment for the next step of packaging, testing, or storage. The automatic unloading system can transport the material tray to the designated area through a conveyor belt or a robotic arm.
