In today's fast-changing technology environment, quickly turning innovative ideas into products is key to business success. USI established the Miniaturization Innovation R&D Center (MCC) to address this important challenge and launch a breakthrough SiP dual-engine technology platform. This innovative solution enables rapid modular design for different market applications.
MCC's SiP dual-engine technology platform provides a full range of solutions for module production, using mature transfer molding technology to meet the needs of large-scale, highly integrated and ultra-miniaturized modules. At the same time, Printing Encap technology enables flexible modularity for a wide range of applications thanks to its high-density, reliable and highly resilient packaging capabilities.
USI Miniaturization Innovation R&D Center SiP dual-engine technology platform
Printing Encap provides an innovative approach to module encapsulation, which is a cost-effective process technology that significantly reduces the development cycle from 12 weeks to 1 week by printing the mold in a vacuum chamber with liquid sealant printing without the need for custom tooling.
Unlike other molding technologies, Printing Encap operates at room temperature and is suitable for a wide range of substrate materials, including BT substrates, substrate-like (SLP), FR4 PCBs, flex boards, rigid-flex plates, glass substrates, or ceramic substrates. This flexibility enables the use of lower-cost FR4 boards, further accelerating time-to-market and lowering the barrier to entry for miniaturization. Printing Encap is particularly suitable for high-density and fine-pitch packages for components that are not resistant to high temperatures or high pressures, as well as for large modules.
Yongcheng Fang, Director of USI Technology, said, "The miniaturization technology of the MCC Miniaturization Innovation R&D Center provides a high degree of flexibility. We work with customers in different application areas to customize component sizes, overcome assembly complexity, and provide flexible modular solutions for different carrier board requirements, module specifications, development timelines, throughput, product diversity, and cost targets. "
The capabilities of the MCC Miniaturization Innovation R&D Center are not limited to the SiP dual-engine technology platform, but also cover the integration of various heterogeneous components into complex modules. The development team has a full range of design services and dedicated production equipment, which can provide customers with seamless services from product concept to mass production, ensuring that advanced system integration can be successfully realized.