On June 20, 2025, at the Huawei Developer Conference (HDC 2025), Zhang Ping'an, Executive Director of Huawei Cloud, officially launched the CloudRobo Embodied Intelligence Platform and announced a partnership with Youai Zhiheng to focus on advancing technology implementation in the semiconductor manufacturing sector. The platform is based on Huawei's PanGu large model's multimodal and cognitive capabilities, integrating end-to-end services from data processing, model development to simulation verification. It is equipped with three core models-embodied multimodal generation, planning, and execution-providing foundational support for robotic intelligent decision-making.
Youai Zhiheng, centered on its robot intelligence brain MAIC, has developed a multi-modal general-purpose foundation large model and an "one brain, multiple modes" edge-side control model, enabling multi-modal fusion perception and adaptive multi-arm collaboration for robot clusters within semiconductor factories. After integrating its intelligent logistics solutions into the CloudRobo platform, it can synchronize production system data in real time, dynamically update task planning, and achieve intelligent handling and transportation scheduling of wafer materials. Both parties stated that this collaboration will drive the large-scale application of embodied intelligence in high-precision manufacturing scenarios, providing a new paradigm for the intelligent upgrading of semiconductor production lines.